WORKSHOP: ALD for Industry 2021
Dezember 1 - Dezember 2
5th Workshop, Tutorial & Exhibition
after four successful events we are looking forward to the next ALD Meeting.
Atomic Layer Deposition (ALD) is used to deposit ultraconformal thin films with sub-nm film thickness control. The method is unique in the sense that it employs sequential self-limiting surface reactions for growth in the monolayer thickness regime. Today, ALD is a key technology in leading edge semiconductor technology and the field of application in other industries is increasing rapidly. According to market estimates the equipment market alone is currently at an annual revenue of US$ 1.8-1.9 billion (2018) and it is expected to double in the next 4-5 years.
In a European context ALD was invented independently twice in Europe (Russia & Finland) and since the last 15 years Germany has grown to become one of the strongest European markets for ALD in R&D, chemicals, equipment and end users.
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